With reference to the PCB shielded enclosures, view previous page, this version has further performance options including an externally mounted wideband ferrite suppressor which is bonded to the top by a thermally conductive media for efficient heat transfer. Internally, a universal wideband RF absorber membrane is bonded to the underside of the cover to deal with frequencies from 40 MHz to 5 GHz. (see catalog pages 30, 31 and 34 for specification details or click here for EMC Noise Absorber Pads.) The copper alloy 770 enclosure (C77000) is a tough solder-compatible material which does not require plating nor has corrosion-prone bare edges. By combining the shielding effects of the ferrite, absorber membrane, and the enclosure, extremely high attenuation of RF energy is possible.
REMEDIATION FOR GROUPS OF COMPONENTS
Small groups of components, or entire circuit boards, can be shielded right at the source – many times eliminating the need for any other types of shielding.
ABSORPTION, NOT REFLECTION
The salient benefit of this hybrid shield is the immediate absorption of RF energy; there is little or no dependence on repeated reflections, and their inherent harmonics potential, to dissipate the unwanted signals.
THERMAL INTERFACE GAP PAD
A high heat transfer thermal interface pad bonds the ferrite to the cover of the enclosure to ensure that there is a continuous thermally conductive path from the enclosure body to the ferrite. Useful in certain cases where thermal dissipation is an ancillary need. See part # TGF600M in our Thermal Gap Filler Pads product listing for more technical information.
